Description
NOTE: This Product is Downloadable Only. Single User License, Non-printable and Non-Device Transferable . Requires eMail address and contact information of End User.
The Component Identification Training & Reference Guide is a valuable tool for employee training and quick reference. This comprehensive component identification resource for electronics assembly operators and inspectors contains color photographs, computer graphics, schematic symbols and detailed descriptions of more than 50 common through-hole and surface mount components used in electronics assembly today.
The new Revision J contains updated info on SSOP, TSOP, QFP, LQFP, PQFP, LCC, QFN, and BGA-related packages, including all the variations within those groups.
New components include DFN, QFN – Multi Row, PoP (Package on Package), CSP (ChipScale Package), COB (Chip on Board), Bare Die and Flip Chip. Also includes a new section stressing the dangers of cross contamination when using Lead Free components and assemblies.
The Terminology Section has quick facts on polarity, orientation, lead styles and Component Reference Designators (CRDs). The "Reading Component Values" section has full-color, easy-to-use color code charts for resistors and inductors, as well as charts for reading numbered capacitor data. Released January 2018.
IMPORTANT: Single-Device DRM-Protected Document
This document has single-device/user digital rights management (DRM) protection. This document will only be accessible by a single user on a single device. If you are purchasing this DRM-protected document for another user, you will need to provide contact information for that user when placing your order.