Home Standards & Manuals IPC-7525B Stencil Design Guidelines

IPC-7525B Stencil Design Guidelines

SKU: 7525B

This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included. 14 pages. Released October 2011


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