This standard is the definitive illustrated guide to printed circuit board acceptability. This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards.
With over 90 new or revised photographs and illustrations, this document provides new coverage on topics such as copper wrap plating, copper cap plating of filled holes, and hole wall/barrel separation along with updated and expanded coverage for measling of printed boards, delamination and haloing, laminate voids/cracks, etchback, blind and buried via fill, and flexible circuits.
The document synchronizes to the acceptability requirements expressed in IPC-6012C and IPC-6013B.
Released April 2010.