Now updated to Revision F of the IPC-A-610 -- the Acceptability of Electronic Assemblies -- this media-based training program is a cost-effective and efficient way to train and test your entire workforce to the most widely recognized industry standard on surface mount solder joint criteria.
DVD-SMT-F uses state-of-the-art computer graphics and animations, as well as microphotography to insure operator-level comprehension of some of the key acceptance requirements from the IPC-A-610F for Chip, J-Lead, and Gull Wing solder joints, as illustrated in the DRM-SMT-F -- Surface Mount Solder Joint Evaluation Training & Reference Guide. (Complimentary copy of DRM-SMT-F included with purchase of this DVD.)
This updated video also covers solder joint quality standards for two new Area Array component types: Ball Grid Arrays (BGAs) and Bottom Termination Components (BTCs).
DVD menu controls allows instructors to select from Class 2 or Class 3 acceptance criteria. Course contents cover quality standards for dimensional criteria -- such as End Overhang, Side Joint Width, Fillet Height, etc. -- as well as defect identification for such undesirable conditions as Solder Balls, Blowholes, Solder Webbing, Chip-Outs, Non-Coplanarity, Incomplete Reflow, and more.
Also includes optional English subtitles (SDH) for the deaf or hard of hearing, and ESL students, Leader’s Guide, Review Questions, IPC Training Certification* Certificates for students who pass the final examination, and one free copy of DRM-SMT-F. Time: 36 minutes.