IPC J-STD-001F is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for both traditional solder alloys and for lead-free manufacturing. Examples of some of the significant changes are revision to plated-through hole, PTH, minimum fill requirements; criteria for two new SMT termination types; and expanded conformal coating criteria. Whenever possible, the criteria descriptions have been adjusted to make them easier to understand for materials, methods and verification for producing quality soldered interconnections and assemblies. The requirements for all three classes of construction are included. Full color illustrations are provided for clarity. This...

IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610F illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions, supported by full-color photographs and illustrations. This revision includes two new SMT termination styles, as well as changes in plated-through hole fill and BGA void criteria. Additionally, wherever possible statements were modified to make readability easier and to enhance understanding — all without eliminating any requirements.

Major topics include flex attachment, board-in-board, part-on-part, both lead-free and tin-lead criteria, component orientation and soldering criteria...

This is the NEW Revision "E"

IPC/WHMA-A-620 remains the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC and the Wire Harness Manufacturers Association (WHMA) continued to work together to develop this significant update.

The standard has over 700 full-color pictures and illustrations. Included in the 19 chapters are criteria for wire prep, soldering to terminals, crimping of stamped and formed contacts and machined contacts, insulation displacement connectors, ultrasonic welding, splicing, connectors, molding, marking, coax/biax cables, wrapping/lacing, shielding, assembly and wire-wrap terminations.

Also covered are the criteria for molding, potting, splicing, crimp contacts...

IPC J-STD-001HS space and military addendum, supplements or replaces specifically identified requirements of IPC J-STD-001H requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications. Pages: 36

IPC J-STD-001F is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for both traditional solder alloys and for lead-free manufacturing. Examples of some of the significant changes are revision to plated-through hole, PTH, minimum fill requirements; criteria for two new SMT termination types; and expanded conformal coating criteria. Whenever possible, the criteria descriptions have been adjusted to make them easier to understand for materials, methods and verification for producing quality soldered interconnections and assemblies. The requirements for all three classes of construction are included. Full color illustrations are provided for clarity. This...

This Addendum supplements or replaces specifically identified requirements of IPC J-STD-001, Revision G, for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space. 28 pages.  Released April 2018.

This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721C Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures.

Part 1 General Requirements has also been updated for ease of use and provides important direction and...

NOTE: This Product is Downloadable Only. Single User License, Non-printable and Non-Device Transferable . Requires email address and contact information of End User.

IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610F illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions, supported by full-color photographs and illustrations. This revision includes two new SMT termination styles, as well as changes in plated-through hole fill and BGA void criteria. Additionally, wherever possible statements were modified to make readability easier and...

The Component Identification Training & Reference Guide is a valuable tool for employee training and quick reference. This comprehensive component identification resource for electronics assembly operators and inspectors contains color photographs, computer graphics, schematic symbols and detailed descriptions of more than 50 common through-hole and surface mount components used in electronics assembly today.

The new Revision J contains updated info on SSOP, TSOP, QFP, LQFP, PQFP, LCC, QFN, and BGA-related packages, including all the variations within those groups.

New components include DFN, QFN – Multi Row, PoP (Package on Package), CSP (ChipScale Package), COB (Chip on Board), Bare Die and...

The definitive illustrated guide to printed board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information. With 120 new or revised photographs and illustrations, revision J provides new coverage on topics such as microvia contact dimensions, plating, voiding and fill, along with updated and expanded coverage for dielectric removal (etchback, smear and wicking), plating folds, surface plating for edge connectors, SMT and BGA pads, marking, hole registration, delamination, cap...

The IPC-A-600K is the definitive illustrated guide to printed board acceptability! The IPC-A-600K is a four-color document providing photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information.

Revision "K" provides dozens of new or revised photographs and illustrations, along with a new and expanded coverage on topics such as crazing, back-drilled structures, edge-connector lands, copper wrap plating, plating voids and microanomalies, microvia target land piercing, innerlayer separation and plating overhang. The document synchronizes to...

This Addendum supplements or replaces specifically identified requirements of IPC J-STD-001, Revision F, for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space. 18 pages. Released December 2014.

Updated to Revision H of the latest IPC-A-610 industry standard for the Acceptability of Electronic Assemblies, this Training & Reference Guide illustrates critical acceptance criteria for the evaluation of surface mount solder connections.

At only 44 pages and a compact 5.5 x 8.5 inch (14 x 21.5 cm) size, these convenient spiral-bound manuals make it easy for your inspectors and operators to make the right solder joint acceptance decisions for all three classes of product.

Useful as a training aid in the classroom or on the shop floor, QRG-SMT contains computer generated color illustrations of Chip component, Gull Wing, J Lead,...

Updated to Revision D of the IPC/WHMA-A-620, this Training & Reference Guide illustrates the critical acceptance criteria for Wire Harness Assembly -- all in a convenient and compact 5.5 x 8.5 inch (14 x 21.5 cm) size.

QRG-WHA-C explains the basic acceptance criteria for wire harness assemblers, crimp operators, and QA personnel. This handy reference and training tool is a great way to help explain the most important requirements from the industry standard on Wire Harness Acceptability, IPC/WHMA-A-620D. Using easy-to-understand computer-generated graphics and language geared toward factory-level employees, this guide will help insure that your company products meet the required industry...

Now updated to Revision H of the latest IPC-A-610 industry standard for the Acceptability of Electronic Assemblies, this Training & Reference Guide illustrates critical acceptance criteria for the evaluation of through-hole solder connections.

With only 30 pages and a compact 5.5 x 8.5 inch (14 x 21.5 cm) size, these convenient spiral-bound manuals make it easy for your inspectors and operators to make the right solder joint acceptance decisions for all three classes of product.

Useful as a training aid in the classroom, or on the shop floor, QRG-PTH contains computer generated color illustrations of component, barrel and solder-side perspectives of...

IDEA-STD-1010: Acceptability of Electronic Components Distributed in the Open Market is the first and leading quality standard for the visual inspection of electronic components and was designed as a technical resource to serve the electronic component industry regarding the detection of substandard and counterfeit components.

As cited in SAE AS5553 and utilized by NASA, this Standard has sold in more than nineteen (19) countries and is based upon techniques developed as a collaborative effort of the industry's leading Independent Distributors.

IDEA-STD-1010 was created to provide inspection processes and criteria that can be incorporated into the Quality Management System of any...

This handbook contains general information and descriptions of proven techniques for assembly and soldering electronic assemblies. Content was developed and reviewed by noted industry experts and experienced committee members. Sections include: handling electronic assemblies, design considerations, PCBs, components, solderability, materials, component mounting, solder techniques and connections, cleaning, conformal coating, encapsulation and potting, and rework and repair. 290 Pages. Released February 2012.

IPC-6012E specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements.

Revision "E" incorporates many new and expanded requirements in areas such as back-drilled structures, alternative surface finishes, copper wrap plating, marking inks, solderability testing, plating overhang, microsection evaluation, thermal shock and performance-based testing for microvia structures. For use with IPC-6011. Supersedes IPC-6012D.

NOTE: This Product is Downloadable Only. Single User License, Non-printable and Non-Device Transferable . Requires eMail address and contact information of End User.

IPC J-STD-001G Amendment 1 provides the first major revision of the J-STD-001 cleanliness requirements in over 25 years and changes how the industry will address cleaning and residue requirements. Highlights of this amendment include, unless otherwise specified by the User, a requirement for Manufacturers of Class 2 and Class 3 product to quality soldering and/or cleaning processes that result in acceptable levels of flux and other residues where "…the use of the 1.56...

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IPC-J-STD-001H is recognized globally for its criteria on soldering processes and materials. Updated with participants from 27 countries providing input and expertise, the IPC-J-STD-001H standard brings the latest criteria to the industry including guidance on the use of x-ray to inspect through-hole solder conditions that are not visible by any other means.

IPC-J-STD-001H is a must-have for those in the electronics industry with an interest in the process and...

The IPC-HDBK-001H is a companion document to J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies providing guidance and supporting information for the requirements found in the standard. IPC-HDBK-001H is structured to map paragraph-to-paragraph with the standard, it includes the "how-to" and "why" behind many of the criteria in an easy-to-use reference handbook.

This specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements.

Revision D incorporates many new requirements in areas such as HASL coatings, alternative surface finishes, edge plating, marking, microvia capture and target lands, copper cap plating of filled holes, copper filled microvias and dielectric removal. For use with IPC-6011. Supersedes IPC-6012C and IPC-6016

NOTE: This Product is Downloadable Only. Single User License, Non-printable and Non-Device Transferable . Requires eMail address and contact information of End User.

IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610G illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions, supported by full-color photographs and illustrations. Additionally, wherever possible statements were modified to make readability easier and to enhance understanding — all without eliminating any requirements.

Some significant changes to 610G:

    •    The...

This is the NEW Revision "D"

NOTE: This Product is Downloadable Only. Single User License, Non-printable and Non-Device Transferable . Requires eMail address and contact information of End User.

IPC/WHMA-A-620 remains the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC and the Wire Harness Manufacturers Association (WHMA) continued to work together to develop this significant update.

The standard has over 700 full-color pictures and illustrations. Included in the 19 chapters are criteria for wire prep, soldering to terminals, crimping of stamped and formed contacts and machined contacts, insulation...

This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision M contains over 220 new or revised terms, including new terminology for conformal coatings, potting and encapsulation processes, stencil design, statistical process control, and flexible printed board technology. Also includes commonly used industry acronyms. 123 pages. Released 2015.

A learning resource for new hires, operators, sales, purchasing, human resources, administrative personnel, students or anyone interested in understanding the basic processes for both Through-Hole and Surface Mount Assembly. This 32-page, full color, 5 x 8 inch spiral bound Desk Reference Manual explains electronics assembly to the uninitiated. DRM-53 includes over 70 color photographs and graphic drawings to clearly illustrate assembly technologies in easy to understand terms. Key terms are defined in a glossary -- to help simplify the industry lexicon. Also explains how electronics assembly fits into the electronics industry. Each section includes references for additional training and industry...

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IPC-A-610H is the most widely used electronics assembly acceptance standard in the electronics industry. IPC-A-610H standard includes a general update to the document, introduces several new surface mount component types and removes target conditions. Participants from 29 countries provided their input and expertise to bring this document to the electronics industry.

This is a must-have for inspectors, operators and others with an interest in the acceptance criteria for electronic assemblies....

Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. These procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC. 32 pages. Released April 2018.

The IPC-6012ES space addendum provides exceptions to Class 3 requirements of the IPC-6012E for use in space and military avionics product. Exceptions include changes to acceptance criteria and/or sample size and test frequency for production lot acceptance testing. The IPC-6012ES covers requirements for rigid printed boards to survive vibration, extreme thermal cycling and ground testing associated with space travel environment.

This Addendum supplements or replaces specifically identified requirements of IPC-6012D, Revision D, for rigid printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics.

IPC-2221B is the foundation design standard for all documents in the IPC-2220 series. It establishes the generic requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or multilayer. Among the many updates to Revision B are new criteria for conductor characteristics, surface finishes, via protection, board electrical test, dielectric properties, board housings, thermal stress, compliant pins, panelization and internal and external foil thicknesses. Appendix A provides new test coupon designs used for lot acceptance and quality conformance testing. 170 pages. Released 2012.

NOTE: This Product is Downloadable Only. Single User License, Non-printable and Non-Device Transferable . Requires eMail address and contact information of End User.

The Component Identification Training & Reference Guide is a valuable tool for employee training and quick reference. This comprehensive component identification resource for electronics assembly operators and inspectors contains color photographs, computer graphics, schematic symbols and detailed descriptions of more than 50 common through-hole and surface mount components used in electronics assembly today.

The new Revision J contains updated info on SSOP, TSOP, QFP, LQFP, PQFP, LCC, QFN, and BGA-related packages,...

NOTE: This Product is Downloadable Only. Single User License, Non-printable and Non-Device Transferable . Requires eMail address and contact information of End User.

This standard is the companion document to IPC-A-630. IPC-HDBK-630 is an in-depth guideline to the design, manufacture, inspection and testing of the high level assembly, or "box" that encloses electronics assemblies. This document was written to help designers, manufacturers and end users of electronic enclosures of electrical and electronic equipment understand the industry's best practices to meet requirements — ensuring the reliability and function of the end-item assembly for its...

NOTE: This Product is Downloadable Only. Single User License, Non-printable and Non-Device Transferable . Requires eMail address and contact information of End User.

IPC J-STD-001HS space and military addendum, supplements or replaces specifically identified requirements of IPC J-STD-001H requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications. Published 05-01-2021. Pages: 36

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