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Updated to Revision H of the latest IPC-A-610 industry standard for the Acceptability of Electronic Assemblies, this Training & Reference Guide illustrates critical acceptance criteria for the evaluation of surface mount solder connections.
Useful as a training aid in the classroom or on the shop floor, QRG-SMT contains computer generated color illustrations of Chip component, Gull Wing, J Lead, BTC and Area Array solder joints. Each drawing clearly shows the minimum acceptable condition for each type of component misalignment; and details all of the specifications for minimum/maximum solder joint size, including fillet heights and lengths.
QRG-SMT-H also contains high quality color microphotographs of the major solder defects and conditions such as nonwetting, solder bridging and disturbed joints, including samples of both tin-lead and lead-free solder connections. The appropriate specification/paragraph references from the IPC-A-610H are included for each of the acceptance criteria for further verification.
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