The Component Identification Training & Reference Guide is a valuable tool for employee training and quick reference. This comprehensive component identification resource for electronics assembly operators and inspectors contains color photographs, computer graphics, schematic symbols and detailed descriptions of more than 50 common through-hole and surface mount components used in electronics assembly today.

The new Revision J contains updated info on SSOP, TSOP, QFP, LQFP, PQFP, LCC, QFN, and BGA-related packages, including all the variations within those groups.

New components include DFN, QFN – Multi Row, PoP (Package on Package), CSP (ChipScale Package), COB (Chip on Board), Bare Die and...

This Addendum supplements or replaces specifically identified requirements of IPC J-STD-001, Revision G, for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space. 28 pages.  Released April 2018.

This updated full-color, 18 x 24-inch wall poster visually defines minimum/maximum Class 3 through hole solder joint acceptability requirements from Revision G of the IPC-A-610 industry standard, Acceptability of Electronic Assemblies. Containing high-quality computer graphics, this poster depicts complex through hole solder joint requirements so clearly, that all operators and inspectors can easily understand and apply this important criteria.

Bring technically accurate, industry-consensus acceptability standards to your training room or inspection area with this visual learning and reference tool. Product includes one poster, for Class 3.

This updated full-color, 18 x 24-inch wall poster visually defines minimum/maximum Class 2 through hole solder joint acceptability requirements from Revision G of the IPC-A-610 industry standard, Acceptability of Electronic Assemblies. Containing high-quality computer graphics, this poster depicts complex through hole solder joint requirements so clearly, that all operators and inspectors can easily understand and apply this important criteria.

Bring technically accurate, industry-consensus acceptability standards to your training room or inspection area with this visual learning and reference tool. Product includes one poster, for Class 2.

Three updated full-color, 18 x 24-inch laminated wall posters visually define minimum/maximum Class 3 surface mount solder joint acceptability requirements from Revision G of the IPC-A-610 industry standard, Acceptability of Electronic Assemblies. Containing high-quality computer graphics, each poster depicts surface mount solder joint requirements so clearly, that operators and inspectors can easily understand and apply this important criteria. Bring technically accurate, industry-consensus acceptability standards to your training room or inspection area with these visual learning and reference tools.

This three-poster set includes one poster each for Class 3 Chip, Gull Wing and J-Lead component requirements.

Three updated full-color, 18 x 24-inch laminated wall posters visually define minimum/maximum Class 2 surface mount solder joint acceptability requirements from Revision G of the IPC-A-610 industry standard, Acceptability of Electronic Assemblies. Containing high-quality computer graphics, each poster depicts surface mount solder joint requirements so clearly, that operators and inspectors can easily understand and apply this important criteria. Bring technically accurate, industry-consensus acceptability standards to your training room or inspection area with these visual learning and reference tools.

This three-poster set includes one poster each for Class 2 Chip, Gull Wing and J-Lead component requirements.

The officially recognized "Lead Free" soldering certification training kit for IPC-7711/7721 Revision "C" operator (CIS) certification. This kit contains a variety of components in lead free format to allow for the evaluation and testing of students for not only initial certification, but also recertification.

Includes optional components and features such as SMT tantalum caps and 0201 resistors, inner layer and multi-layer repair sections, conformal coating section, damaged surface conductors ready for repair and components with adhesive staking.  Includes one (1) lead free assembled board and one (1) set of lead free components.

Contains the following materials (in "Lead Free"):
(1) Fully...

The officially recognized soldering certification training kit for IPC-7711/7721 Revision "C" operator (CIS) certification. This kit contains a variety of components to allow for the evaluation and testing of students for not only initial certification, but also recertification.

Includes optional components and features such as SMT tantalum caps and 0201 resistors, inner layer and multi-layer repair sections, conformal coating section, damaged surface conductors ready for repair and components with adhesive staking.  Includes one (1) assembled board and one (1) set of components.

Contains the following materials:
(1) Fully Assembled Board
(6) 1/4 Watt Resistor
(6) 16 Lead Dip
(6) T05/39 Transistor
(6) Transistor Standoff
(6) CK06...

This Addendum supplements or replaces specifically identified requirements of IPC-6012D, Revision D, for rigid printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics.

Looking to sharpen your soldering skills with a more realistic soldering production training kit?  Look no further. This through hole soldering kit comes with two practice boards and double, and in some cases triple, the number of components to assemble, so you can solder and hone those skills. The components are guaranteed solderable and shipped in static shielded bags. Buy one kit and share in a class, with plenty of components to practice with.

Contains the following materials:
(2) Through Hole Technology Boards
(10) Axial Diodes
(4) Electrolytic Capacitors
(20) CKO6 Capacitors with Stand-offs
(20) 1/4 Watt Resistors
(12) 1/2 Watt Resistors
(6) 16 Pin DIP ICs
(10)...

IPC's J-STD-001 is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for both traditional solder alloys and for lead-free manufacturing.

Whenever possible, the criteria descriptions have been adjusted to make them easier to understand for materials, methods and verification for producing quality soldered interconnections and assemblies.

 Some Significant Changes to 001G:

    •    The "International Space Station Symbol" Replaces the "Space Shuttle Symbol" Throughout the Document
    •    General Section Scope and Purpose were Re-evaluated and Updated
    •    General Section New Section on Objective
    •    Improved language for ease of readability...

IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610G illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions, supported by full-color photographs and illustrations. Additionally, wherever possible statements were modified to make readability easier and to enhance understanding — all without eliminating any requirements.

Some significant changes to 610G:

    •    The Standard Remains a Visual Quality Acceptance Standard
    •    In the General Section – Significant Changes Were Made to Various Topics
    •    Various Updates to Acceptance and Defect...

Updated to Revision C of the IPC/WHMA-A-620, this Training & Reference Guide illustrates the critical acceptance criteria for Wire Harness Assembly -- all in a convenient and compact 5.5 x 8.5 inch (14 x 21.5 cm) size.

DRM-WHA-C explains the basic acceptance criteria for wire harness assemblers, crimp operators, and QA personnel. This handy reference and training tool is a great way to help explain the most important requirements from the industry standard on Wire Harness Acceptability, IPC/WHMA-A-620C. Using easy-to-understand computer-generated graphics and language geared toward factory-level employees, this guide will help insure that your company products meet the required...

IPC/WHMA-A-620 remains the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC and the Wire Harness Manufacturers Association (WHMA) continued to work together to develop this significant update.

The standard has over 700 full-color pictures and illustrations. Included in the 19 chapters are criteria for wire prep, soldering to terminals, crimping of stamped and formed contacts and machined contacts, insulation displacement connectors, ultrasonic welding, splicing, connectors, molding, marking, coax/biax cables, wrapping/lacing, shielding, assembly and wire-wrap terminations.

Also covered are the criteria for molding, potting, splicing, crimp contacts without insulation support, inline insulation displacement connectors, connectorization,...

This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721C Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures.

Part 1 General Requirements has also been updated for ease of use and provides important direction and...

The definitive illustrated guide to printed board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information. With 120 new or revised photographs and illustrations, revision J provides new coverage on topics such as microvia contact dimensions, plating, voiding and fill, along with updated and expanded coverage for dielectric removal (etchback, smear and wicking), plating folds, surface plating for edge connectors, SMT and BGA pads, marking, hole registration, delamination, cap...

IPC J-STD-001F is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for both traditional solder alloys and for lead-free manufacturing. Examples of some of the significant changes are revision to plated-through hole, PTH, minimum fill requirements; criteria for two new SMT termination types; and expanded conformal coating criteria. Whenever possible, the criteria descriptions have been adjusted to make them easier to understand for materials, methods and verification for producing quality soldered interconnections and assemblies. The requirements for all three classes of construction are included. Full color illustrations are provided for clarity. This...

IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610F illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions, supported by full-color photographs and illustrations. This revision includes two new SMT termination styles, as well as changes in plated-through hole fill and BGA void criteria. Additionally, wherever possible statements were modified to make readability easier and to enhance understanding — all without eliminating any requirements.

Major topics include flex attachment, board-in-board, part-on-part, both lead-free and tin-lead criteria, component orientation and soldering criteria...