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IPC-7094 Design and Assembly Process Implementation for Flip Chip and Die Size Components
IPC-7094 Design and Assembly Process Implementation for Flip Chip and Die Size Components

Implementing flip chip technology in a direct chip attach (DCA) assembly presents...

$184.00 | SKU: 7094-STD-0-P-0-EN-A
IPC-7095C Design and Assembly Process Implementation for BGAs
IPC-7095C Design and Assembly Process Implementation for BGAs

Implementing ball grid array (BGA) and fine-pitch ball grid array (FBGA) technology...

$184.00 | SKU: 7095-STD-0-P-0-EN-C
IPC-HDBK-830A Guidelines for Design, Selection, and Application of Conformal Coatings
IPC-HDBK-830A Guidelines for Design, Selection, and Application of Conformal Coatings

This handbook is a compilation of the conformal coating industry's practical experience,...

$184.00 | SKU: 830-HB-0-P-0-EN-A