NOTE: This Product is Downloadable Only. Single User License, Non-printable and Non-Device Transferable . Requires eMail address and contact information of End User.

IPC/WHMA-A-620 remains the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC and the Wire Harness Manufacturers Association (WHMA) continued to work together to develop this significant update.

The standard has over 700 full-color pictures and illustrations. Included in the 19 chapters are criteria for wire prep, soldering to terminals, crimping of stamped and formed contacts and machined contacts, insulation displacement connectors, ultrasonic welding, splicing, connectors, molding,...

IPC's J-STD-001 is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for both traditional solder alloys and for lead-free manufacturing.

Whenever possible, the criteria descriptions have been adjusted to make them easier to understand for materials, methods and verification for producing quality soldered interconnections and assemblies.

 Some Significant Changes to 001G:

    •    The "International Space Station Symbol" Replaces the "Space Shuttle Symbol" Throughout the Document
    •    General Section Scope and Purpose were Re-evaluated and Updated
    •    General Section New Section on Objective
    •    Improved language for ease of readability...

This Addendum supplements or replaces specifically identified requirements of IPC J-STD-001, Revision G, for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space. 28 pages.  Released April 2018.

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IPC J-STD-001G Amendment 1 provides the first major revision of the J-STD-001 cleanliness requirements in over 25 years and changes how the industry will address cleaning and residue requirements. Highlights of this amendment include, unless otherwise specified by the User, a requirement for Manufacturers of Class 2 and Class 3 product to quality soldering and/or cleaning processes that result in acceptable levels of flux and other residues where "…the use of the 1.56...

This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721C Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures.

Part 1 General Requirements has also been updated for ease of use and provides important direction and...

IPC J-STD-001F is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for both traditional solder alloys and for lead-free manufacturing. Examples of some of the significant changes are revision to plated-through hole, PTH, minimum fill requirements; criteria for two new SMT termination types; and expanded conformal coating criteria. Whenever possible, the criteria descriptions have been adjusted to make them easier to understand for materials, methods and verification for producing quality soldered interconnections and assemblies. The requirements for all three classes of construction are included. Full color illustrations are provided for clarity. This...

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IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610G illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions, supported by full-color photographs and illustrations. Additionally, wherever possible statements were modified to make readability easier and to enhance understanding — all without eliminating any requirements.

Some significant changes to 610G:

    •    The...

NOTE: This Product is Downloadable Only. Single User License, Non-printable and Non-Device Transferable . Requires email address and contact information of End User.

IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610F illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions, supported by full-color photographs and illustrations. This revision includes two new SMT termination styles, as well as changes in plated-through hole fill and BGA void criteria. Additionally, wherever possible statements were modified to make readability easier and...

This Addendum supplements or replaces specifically identified requirements of IPC J-STD-001, Revision F, for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space. 18 pages. Released December 2014.

This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision M contains over 220 new or revised terms, including new terminology for conformal coatings, potting and encapsulation processes, stencil design, statistical process control, and flexible printed board technology. Also includes commonly used industry acronyms. 123 pages. Released 2015.

Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. These procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC. 32 pages. Released April 2018.

IPC J-STD-001F is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for both traditional solder alloys and for lead-free manufacturing. Examples of some of the significant changes are revision to plated-through hole, PTH, minimum fill requirements; criteria for two new SMT termination types; and expanded conformal coating criteria. Whenever possible, the criteria descriptions have been adjusted to make them easier to understand for materials, methods and verification for producing quality soldered interconnections and assemblies. The requirements for all three classes of construction are included. Full color illustrations are provided for clarity. This...

IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610F illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions, supported by full-color photographs and illustrations. This revision includes two new SMT termination styles, as well as changes in plated-through hole fill and BGA void criteria. Additionally, wherever possible statements were modified to make readability easier and to enhance understanding — all without eliminating any requirements.

Major topics include flex attachment, board-in-board, part-on-part, both lead-free and tin-lead criteria, component orientation and soldering criteria...

This handbook contains general information and descriptions of proven techniques for assembly and soldering electronic assemblies. Content was developed and reviewed by noted industry experts and experienced committee members. Sections include: handling electronic assemblies, design considerations, PCBs, components, solderability, materials, component mounting, solder techniques and connections, cleaning, conformal coating, encapsulation and potting, and rework and repair. 290 Pages. Released February 2012.

NOTE: This Product is Downloadable Only. Single User License, Non-printable and Non-Device Transferable . Requires eMail address and contact information of End User.

This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. This single volume includes all previously published changes and several new procedures for BGAs (including reballing) and flex-print repair.

Part 1 General Requirements has also...

The IPC-HDBK-001H is a companion document to J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies providing guidance and supporting information for the requirements found in the standard. IPC-HDBK-001H is structured to map paragraph-to-paragraph with the standard, it includes the "how-to" and "why" behind many of the criteria in an easy-to-use reference handbook.

IPC J-STD-001HS space and military addendum, supplements or replaces specifically identified requirements of IPC J-STD-001H requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications. Pages: 36

NOTE: This Product is Downloadable Only. Single User License, Non-printable and Non-Device Transferable . Requires eMail address and contact information of End User.

IPC J-STD-001HS space and military addendum, supplements or replaces specifically identified requirements of IPC J-STD-001H requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications. Published 05-01-2021. Pages: 36

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