This Addendum supplements or replaces specifically identified requirements of IPC-6012D, Revision D, for rigid printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics.

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This specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements.

Revision D incorporates many new requirements in areas such as HASL coatings, alternative surface finishes, edge plating, marking, microvia...

The definitive illustrated guide to printed board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information. With 120 new or revised photographs and illustrations, revision J provides new coverage on topics such as microvia contact dimensions, plating, voiding and fill, along with updated and expanded coverage for dielectric removal (etchback, smear and wicking), plating folds, surface plating for edge connectors, SMT and BGA pads, marking, hole registration, delamination, cap...

NOTE: This Product is Downloadable Only. Single User License, Non-printable and Non-Device Transferable . Requires eMail address and contact information of End User.

The definitive illustrated guide to printed board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information. With 120 new or revised photographs and illustrations, revision J provides new coverage on topics such as microvia contact dimensions, plating, voiding and fill, along with...

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Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect  functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification, resistances to solvents, and electrical requirements.

Revision E incorporates requirements for flexible cover materials used as...

The IPC-6013D covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried vias. IPC-6013D incorporates new and updated requirements for final finishes, rigid-to-flex transition zones, deformation anomalies including wrinkles, creases and soda strawing, marking, registration (annular ring), conductor thickness reductions, dielectric removal in holes, resin smear, copper filled microvias and selective (button) hole plating.

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IPC-9252 defines levels of appropriate testing and assists in the selection of the test analyzer, test parameters, test data and fixturing required to perform electrical test(s) on unpopulated printed boards and inner layers. Revision B provides new requirements for resistive and indirect continuity and isolating testing, test record marking and traceability and an updated sample electrical test certificate of conformance (C of C).

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