The Component Identification Training & Reference Guide is a valuable tool for employee training and quick reference. This comprehensive component identification resource for electronics assembly operators and inspectors contains color photographs, computer graphics, schematic symbols and detailed descriptions of more than 50 common through-hole and surface mount components used in electronics assembly today.
The new Revision J contains updated info on SSOP, TSOP, QFP, LQFP, PQFP, LCC, QFN, and BGA-related packages, including all the variations within those groups.
New components include DFN, QFN – Multi Row, PoP (Package on Package), CSP (ChipScale Package), COB (Chip on Board), Bare Die and...